化工进展 ›› 2015, Vol. 34 ›› Issue (05): 1254-1258.DOI: 10.16085/j.issn.1000-6613.2015.05.012

• 化工过程与装备 • 上一篇    下一篇

铝基Al2O3纳米多孔表面大容积池沸腾实验

左少华1, 赵晓玥2, 王杰阳3, 魏峰1, 史晓平1, 陶金亮1   

  1. 1. 河北工业大学化工学院, 天津 300130;
    2. 西安交通大学化学工程与技术学院, 陕西 西安 710049;
    3. 天津科技大学机械工程学院, 天津 300222
  • 收稿日期:2014-10-16 修回日期:2014-11-19 出版日期:2015-05-05 发布日期:2015-05-05
  • 通讯作者: 陶金亮,博士,副教授,主要从事传热过程强化技术与装备、蒸发研发与设计等领域研究工作.E-mailtaojin@hebut.edu.cn.
  • 作者简介:左少华(1986—),男,硕士研究生,研究方向为化工过程强化与优化.E-mailzuoshaohua_hebut@163.com.
  • 基金资助:

    河北省自然科学基金项目(B2012202082).

Experimental study on pool boiling of aluminum base Al2O3 nano-porous surface

ZUO Shaohua1, ZHAO Xiaoyue2, WANG Jieyang3, WEI Feng1, SHI Xiaoping1, TAO Jinliang1   

  1. 1. School of Chemical Engineering, Hebei University of Technology, Tianjin 300130, China;
    2. School of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an 710049, Shaanxi, China;
    3. School of Mechanical Engineering, Tianjin University of Science & Technology, Tianjin 300222, China
  • Received:2014-10-16 Revised:2014-11-19 Online:2015-05-05 Published:2015-05-05

摘要: 目前微电子器件不断地向高密度、微型化、功能化方向发展,散热问题是制约技术进一步发展的瓶颈.本文拟利用纳米多孔表面优良的相变传热特性,解决电子器件微型化散热难的问题.文中以铝基Al2O3纳米多孔薄膜为传热表面,以去离子水为工质,常压下对其大容积池沸腾下的传热性能进行了实验研究.实验结果表明:与光滑表面相比,Al2O3纳米多孔表面在核态沸腾时汽化核心密集,产生汽泡体积小、数量多并能提高铝基传热表面的传热系数2~5倍,且能够在长时间内维持其较高的传热系数;以纳米多孔表面作为传热表面,可以有效降低微电子原件表面温度3~5℃,在核态沸腾阶段能够降低30℃以上,很好地起到了降低电子元件表面温度的作用.实验结果对微电子冷却有重要的参考作用.

关键词: 多孔介质, 传热, 氧化铝, 池沸腾, 芯片散热

Abstract: The problem of heat dissipation is the bottleneck for the further development of micro-devices because the high density,microminiaturization and functional systemic. In this paper,Nano-porous surfaces' excellent phase change heat transfer characteristics were analyzed to solve this problem. An experimental study on the pool boiling heat transfer performance of the aluminum base Al2O3 nano-porous film was conducted with water under normal pressure. Experimental results showed that Al2O3 nano-porous surface improved the heat transfer coefficient of the aluminum heat transfer surfaces 2—5 times compared with the smooth-surfaced devices,and could maintain high heat transfer coefficient in a long time,because the intensive vaporized core could produce large amount of small bubbles. The surface temperature of microelectronic could be effectively decreased by 3—5℃,even by more than 30℃ in nucleate boiling stage with nano-porous surface as heat transfer surface.

Key words: porous media, heat transfer, alumina, polling boiling, electronic chip cooling

中图分类号: 

京ICP备12046843号-2;京公网安备 11010102001994号
版权所有 © 《化工进展》编辑部
地址:北京市东城区青年湖南街13号 邮编:100011
电子信箱:hgjz@cip.com.cn
本系统由北京玛格泰克科技发展有限公司设计开发 技术支持:support@magtech.com.cn