关键词: 多孔介质, 传热, 氧化铝, 池沸腾, 芯片散热

Abstract: The problem of heat dissipation is the bottleneck for the further development of micro-devices because the high density,microminiaturization and functional systemic. In this paper,Nano-porous surfaces' excellent phase change heat transfer characteristics were analyzed to solve this problem. An experimental study on the pool boiling heat transfer performance of the aluminum base Al₂O₃ nano-porous film was conducted with water under normal pressure. Experimental results showed that Al₂O₃ nano-porous surface improved the heat transfer coefficient of the aluminum heat transfer surfaces 2—5 times compared with the smooth-surfaced devices,and could maintain high heat transfer coefficient in a long time,because the intensive vaporized core could produce large amount of small bubbles. The surface temperature of microelectronic could be effectively decreased by 3—5℃,even by more than 30℃ in nucleate boiling stage with nano-porous surface as heat transfer surface.

Key words: porous media, heat transfer, alumina, polling boiling, electronic chip cooling