化工进展 ›› 2023, Vol. 42 ›› Issue (S1): 374-381.DOI: 10.16085/j.issn.1000-6613.2023-0999

• 材料科学与技术 • 上一篇    下一篇

PEG及其复合添加剂对电解铜箔后处理的影响

张杰1(), 白忠波2, 冯宝鑫2, 彭肖林2, 任伟伟2, 张菁丽1, 刘二勇1()   

  1. 1.西安科技大学材料科学与工程学院,陕西 西安 710054
    2.灵宝华鑫铜箔有限责任公司,河南 灵宝 472599
  • 收稿日期:2023-06-18 修回日期:2023-08-27 出版日期:2023-10-25 发布日期:2023-11-30
  • 通讯作者: 刘二勇
  • 作者简介:张杰(1998—),男,硕士,研究方向为材料表面技术。E-mail:2481501077@qq.com
  • 基金资助:
    国家自然科学基金(52175184);陕西省重点研发计划(2021SF-469);陕西省教育厅服务地方专项计划

Effect of PEG and its compound additives on post-treatment of electrolytic copper foils

ZHANG Jie1(), BAI Zhongbo2, FENG Baoxin2, PENG Xiaolin2, REN Weiwei2, ZHANG Jingli1, LIU Eryong1()   

  1. 1.College of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, Shaanxi, China
    2.Lingbao Huaxin Copper Foil Co. , Ltd. , Lingbao 472599, Henan, China
  • Received:2023-06-18 Revised:2023-08-27 Online:2023-10-25 Published:2023-11-30
  • Contact: LIU Eryong

摘要:

为提高电解铜箔在粗化处理后的抗剥离强度。选择添加剂聚乙二醇-8000(PEG-8000)及PEG和钨酸钠的复合添加剂对12μm电解铜箔进行电镀处理,采用扫描电子显微镜(SEM)、粗糙度检测、电化学分析、X射线衍射分析(XRD)、抗剥离强度及导电性测试来分析添加剂对铜箔表面形貌、性能及添加剂的作用机理分析。随着PEG加入基础镀液,后处理铜箔表面形貌从粗大的树枝晶逐渐转变为短小的粒状晶粒,后处理铜箔粗糙度呈上升趋势。当PEG浓度为0.09g/L时,相较不含添加剂的镀液体系,后处理铜箔抗剥离强度提升达103%,粗糙度升高,PEG的加入会起到促进铜形核和抑制沉积的双重作用。PEG和钨酸钠的复合添加剂加入基础镀液后,当PEG浓度为0.005g/L时,铜箔的抗剥离强度较单一PEG体系提升约21.35%,粗糙度降低约20.34%,由于复合添加剂抑制了铜离子的沉积和形核,并促进了(200)晶面的沉积,铜箔表面晶粒沉积均匀,但晶粒粗大化。PEG单独加入可以大幅提升铜箔的抗剥离强度,且提高粗糙度,PEG和钨酸钠的复合添加剂抗剥离强度进一步提升,且粗糙度下降,深镀能力大幅提升。

关键词: 电解, 铜箔, 表面沉积, 电化学, 抗剥离, 粗糙度, 成核

Abstract:

In order to improve the peel strength of electrolytic copper foil after roughening treatment, the additive PEG and the composite additive of PEG and sodium tungstate were selected to electroplate the 12μm electrolytic copper foil. SEM, roughness detection, electrochemical analysis, XRD analysis, anti-peeling strength and conductivity test were used to analyze the effect of additives on the surface morphology and properties of copper foil and the mechanism of additives. With the addition of PEG to the basic plating solution, the surface morphology of the post-treated copper foil gradually changed from coarse dendrites to short granular grains, and the roughness of the post-treated copper foil showed an upward trend. When the concentration of PEG was 0.09g/L, compared with the plating liquid system without additives, the anti-peeling strength of the post-treatment copper foil was increased by 103%, and the roughness was increased. The addition of PEG played a dual role in promoting copper nucleation and inhibiting deposition. After the composite additive of PEG and sodium tungstate was added to the basic plating solution, the peel strength of the copper foil was about 21.35% higher than that of the single PEG system and the roughness was reduced by about 20.34% when the PEG concentration was 0.005g/L. Because the composite additive inhibited the deposition and nucleation of copper ions and promoted the deposition of (200) crystal plane, the grain deposition on the surface of copper foil was uniform, but the grain was coarse. The addition of PEG alone can greatly improve the peel strength of copper foil with improvement of the roughness. The composite additive of PEG and sodium tungstate further improved the peel strength and decreased the roughness decreases, and thus the deep plating ability was greatly improved.

Key words: electrolysis, copper foil, surface deposition, electrochemistry, peel resistance, roughness, nucleation

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