化工进展 ›› 2018, Vol. 37 ›› Issue (12): 4752-4757.DOI: 10.16085/j.issn.1000-6613.2018-0389

• 材料科学与技术 • 上一篇    下一篇

增韧导热环氧树脂/氮化硼复合材料的制备与表征

徐晨1, 武向南1,2, 张庆新1, 瞿雄伟1   

  1. 1 河北工业大学化工学院, 天津 300130;
    2 北华航天工业学院材料工程学院, 河北 廊坊 065000
  • 收稿日期:2018-02-25 修回日期:2018-08-28 出版日期:2018-12-05 发布日期:2018-12-05
  • 通讯作者: 瞿雄伟,教授,从事功能高分子及复合材料制备及性能研究。
  • 作者简介:徐晨(1990-),女,硕士研究生。E-mail:1054005423@qq.com。
  • 基金资助:
    河北省自然科学基金(E2016202036)及国家自然科学基金(51573037)项目。

Preparation and characterization of epoxy resin/boron nitride composites with enhanced toughness and thermal conductivity

XU Chen1, WU Xiangnan1,2, ZHANG Qingxin1, QU Xiongwei1   

  1. 1 School of Chemical Engineering, Hebei University of Technology, Tianjin 300130, China;
    2 School Materials Science and Engineering, North China Institute of Aerospace Engineering, Langfang 065000, Hebei, China
  • Received:2018-02-25 Revised:2018-08-28 Online:2018-12-05 Published:2018-12-05

摘要: 采用种子乳液聚合方法制备了聚(丙烯酸正丁酯/甲基丙烯酸甲酯-co-甲基丙烯酸缩水甘油酯)核壳增韧剂(PBMG),并用湿法球磨与超声辅助相结合的方法对六方氮化硼(h-BN)进行改性,制备的改性氮化硼(MBN)可提高环氧树脂(EP)的热导率。最后采用机械共混方法制备了环氧树脂/增韧剂/改性氮化硼(EP/PBMG/MBN)复合材料。通过透射电子显微镜(TEM)、扫描电子显微镜(SEM)、X射线衍射(XRD)、动态激光光散射(DLS)、热导率和力学性能等测试对核壳增韧剂的粒子形成、改性氮化硼和复合材料进行了表征。结果发现:最终制备的聚丙烯酸酯乳胶粒子呈现明显的核壳结构,且粒度分布很窄。当聚丙烯酸酯增韧剂添加量为5%、改性氮化硼为8.99%时,环氧树脂/增韧剂/改性氮化硼复合材料的冲击强度和热导率比纯环氧树脂(EP)的分别提高了133%和171%。随着未来的基板材料要求有效的热耗散,这种复合材料有望用于微电子工业上。

关键词: 环氧树脂, 核壳结构, 六方氮化硼, 增韧, 热导率

Abstract: A toughening modifier, poly(n-butyl acrylate)/poly(methyl methacrylate-co-glycidyl methacrylate), PBMG, core-shell structured latex was synthesized via seed emulsion polymerization. Hexagonal boron nitride (h-BN) was modified by wet ball milling combined with sonication to improve the thermal conductivity of epoxy resin (EP), donated as MBN. Then, EP/PBMG/MBN composites were prepared by mechanical mixing. The particle formation of PBMG, MBN and EP/PBMG/MBN composites were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD), dynamic laser scattering (DLS), thermal conductivity and mechanical testing. These measurements showed that the PBMG particle obviously presented a core/shell structure and a narrow size distribution. The unnotched impact strength and the thermal conductivity of the EP/PBMG/MBN composite increased by 133% and 171% compared with those of pure epoxy resin, respectively, when the contents of PBMG and MBN components were 5% and 8.99%. These composites may offer new applications in the microelectronic industry because future substrate materials require effective heat dissipation.

Key words: epoxy resin, core/shell structure, hexagonal boron nitride, toughening, thermal conductivity

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