化工进展 ›› 2018, Vol. 37 ›› Issue (09): 3555-3561.DOI: 10.16085/j.issn.1000-6613.2017-1932

• 材料科学与技术 • 上一篇    下一篇

硅烷改性环氧树脂自修复微胶囊的制备及应用

童晓梅1, 郝芹芹2, 闫子英2, 郑博学2   

  1. 1 西安电子科技大学先进材料与纳米科技学院, 陕西 西安 710126;
    2 陕西科技大学化学与化工学院, 陕西 西安 710021
  • 收稿日期:2017-09-13 修回日期:2017-10-29 出版日期:2018-09-05 发布日期:2018-09-05
  • 通讯作者: 童晓梅(1979-),女,博士,讲师,研究方向为环境友好型高分子材料。
  • 作者简介:童晓梅(1979-),女,博士,讲师,研究方向为环境友好型高分子材料。E-mail:tongxiaomei@sust.edu.cn。
  • 基金资助:
    陕西省教育厅专项科研计划(16JK1110)及陕西省科技计划(2017GY-185)项目。

Preparation and application of epoxy resin self-healing microcapsules modified by silicone

TONG Xiaomei1, HAO Qinqin2, YAN Ziying2, ZHENG Boxue2   

  1. 1 School of Advanced Materials and Nanotechnology, Xidian University, Xi'an 710126, Shaanxi, China;
    2 School of Chemistry and Chemical Engineering, Shaanxi University of Science and Technology, Xi'an 710021, Shannxi, China
  • Received:2017-09-13 Revised:2017-10-29 Online:2018-09-05 Published:2018-09-05

摘要: 采用硅烷偶联剂γ-(2,3-环氧丙氧基)丙基三甲氧基硅烷(KH-560)对环氧树脂E-51进行改性,并以此为芯材,三聚氰胺-脲醛树脂(MUF)为壁材,原位聚合法合成微胶囊,探讨了微胶囊制备工艺,并用光学显微镜(OM)、扫描电子显微镜(SEM)、红外光谱仪(FTIR)、热重分析仪(TGA)等对其表面形貌、化学结构及热性能等进行了表征和测试;之后将改性后的微胶囊应用到自修复环氧树脂涂层中,考察了自修复涂层的力学性能和电化学性能。结果表明,当芯壁比为1.5:1、乳化剂质量分数为1.4%时,微胶囊为规则球形,表面粗糙、致密,大小均匀,平均粒径约为100μm,具有良好的热稳定性。当涂层中改性微胶囊质量分数为3%时,涂层的拉伸强度、弯曲强度、黏结强度及冲击强度均较高,且其较未改性微胶囊自修复涂层分别提高了14.9%、14.3%、16.0%和9.6%;与未改性微胶囊自修复涂层相比,改性微胶囊自修复涂层的电化学性能增强,且电化学阻抗值显著提高。

关键词: 环氧树脂, 硅烷偶联剂, 微胶囊, 自修复涂层, 力学性能, 电化学性能

Abstract: Microcapsules were synthesized by in-situ polymerization. The epoxy resin was chemically modified with γ-(2,3-epoxypropoxy) propyl trimethoxy silane (KH560) and used as the core material and melamine-urea-formaldehyde was employed as the wall material.The preparation process of the microcapsules was discussed. The morphology, structure and thermal properties of the microcapsules were characterized by optical microscope(OM), scanning electron microscope(SEM), Fourier transform infrared spectroscopy(FTIR) and thermogravimetric analysis(TGA). The microcapsules were applied to epoxy resin matrix to prepare self-healing coating. The mechanical properties and the electrochemical properties of the self-healing coating was investigated. The obtained microcapsules were uniform sphere with rough and compact surface and an average size of 100μm, when the core/wall was 1.5:1 and the emulsifier content was 1.4%. The microcapsules possessed good thermal stability. When the microcapsules content in the coating was 3%, the tensile intensity, the bending intensity, the impact intensity and the bonding intensity of the modified self-healing coating increased by 14.9%、14.3%、16.0% and 9.6% respectively, and the electrochemical properties as well as the electrochemical impedance value were significantly enhanced, as compared with the unmodified one.

Key words: epoxy resin, KH-560, microcapsule, self-healing coating, mechanical properties, electrochemical properties

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