均温板散热技术研究进展

doi:10.16085/j.issn.1000-6613.2021-0706

摘要/Abstract

摘要：

均温板作为一种新型的两相流散热技术，具有导热性高、均温性好、热流方向可逆等优点，克服了传统热管接触面积小、热阻大、热流密度不均匀等问题，已经成为解决未来电子工业中高热流密度电子器件散热有效途径之一。本文总结了3种吸液芯种类：微槽道型、烧结粉末型、烧结丝网型，阐述每种毛细芯的制备方法，并比较它们的优缺点；简述了当前国内外对均温板传热传质理论的最新研究进展，学者们利用输运模型沸腾理论捕捉气液界面，确定临界热通量，分析工质在均温板内的流动和传热的规律。本文剖析了影响均温板性能的各个因素，包括流体选择、充液率、热源输入功率大小和分布位置、工作角度等。最后从背景环境角度对均温板的应用方向进行了分析和展望。

关键词: 均温板, 两相流, 传热, 传质, 超薄

Abstract:

As a new two-phase heat transfer technology, vapor chamber has the advantages of high thermal conductivity, good temperature uniformity, reversible heat flow direction, and so on. It overcomes the problems of traditional heat pipe, such as small contact area, large heat resistance and ununiform heat flow density, and has become one of the effective ways to solve the heat dissipation of electronic devices with high heat flow density in the future electronic industry. In this paper, the three types of wick structures, namely, grooved, sintered powder and sintered wire mesh were summarized, and the preparation methods of each capillary wicks were introduced and their advantages and disadvantages were compared. The latest research progress of heat and mass transfer theory in vapor chamber was reviewed. the boiling theory of transport model to capture the gas-liquid interface was used by researchers. The critical heat flux was confirmed. The flow and heat transfer law of working medium was analyzed in the vapor chamber. Then, the factors affecting the performance of vapor chamber, including fluid selection, liquid filling rate, heat load, inclination, et al. were analyzed. Finally, the application direction of the vapor chamber was prospected from the perspective of background environment.

Key words: vapor chamber, two phase flow, heat transfer, mass transfer, ultrathin

中图分类号:

TK172

万晓琪, 崔晓钰, 谢荣建. 均温板散热技术研究进展[J]. 化工进展, 2022, 41(2): 554-568.

WAN Xiaoqi, CUI Xiaoyu, XIE Rongjian. Research progress of vapor chamber heat dissipation technology[J]. Chemical Industry and Engineering Progress, 2022, 41(2): 554-568.

图/表 1

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