Progress of chip-level indirect liquid cooling technology and enhanced heat transfer in data centers

doi:10.16085/j.issn.1000-6613.2023-1761

Abstract

Abstract:

In order to meet the operational requirements of high-heat-flux data centers, liquid cooling technology has gotten more and more attention and research efforts from scholars worldwide. Indirect liquid cooling is regarded as more efficient and energy-saving compared to traditional air cooling methods. However, its heat exchange capabilities are somewhat diminished in comparison to direct liquid contact methods, making the heat transfer enhancement a focal point of research in the realm of indirect liquid cooling. Additionally, indirect liquid cooling presents safety and cost-related challenges, such as liquid leakage and system complexity. Therefore, the integration of different technologies based on their respective strengths and weaknesses has become a meaningful research direction for current data center cooling systems. In this article, a comprehensive review of these key aspects is conducted. The current status and research advancements in the application of single-phase, two-phase, and heat pipe cooling in chip-level data center cooling are thoroughly analyzed. The pathways for enhancing heat transfer in chip-level indirect liquid cooling are outlined from three aspects: fluid dynamics, medium materials, and channel design optimization. Furthermore, the coupling of different technologies for chip-level data center cooling methods has also been organized, primarily including single-phase cooling and heat pipe cooling, along with the use of phase-change materials in conjunction with these methods to enhance energy efficiency and effectiveness. In the future, indirect liquid cooling in data centers still needs to be expanded in the direction of heat dissipation efficiency improvement and technology composite. This study provides a valuable reference for improving the cooling efficiency of high-temperature data centers and expanding the application of indirect liquid cooling technology.

Key words: heat transfer, hydrodynamics, phase change, microchannels, optimal design

摘要：

为了满足高热通量数据中心的工作需求，液冷技术得到国内外学者的重视与研究。间接液冷比传统的风冷技术更具效率、更节能，但较直接接触式液冷传热能力有所减弱，因而强化传热就成为间接液冷的研究重点。此外，间接液冷存在安全或成本问题，如漏液、系统复杂等，因而基于技术优劣、将不同技术综合利用也成为当下数据中心冷却系统有意义的研究方向。本文对这些关键方面进行全面回顾，系统分析了当前单相、双相以及热管冷却在芯片级数据中心冷却的应用现状以及研究进展，从流体动力、介质材料以及流道设计优化三个方面梳理了芯片间接液冷中强化传热的途径。还整理了复合不同技术的芯片级数据中心冷却方式，主要包括单相冷却及热管冷却、相变材料与单相冷却或热管的组合，旨在探索更加节能高效的冷却形式。未来数据中心间接液冷仍需要在散热效率提升及技术复合方向进行拓展。本研究能为提升高温数据中心的冷却效率、拓展间接液冷技术应用提供参考。

关键词: 传热, 流体动力学, 相变, 微通道, 优化设计

CLC Number:

TB61⁺1

YIN Rui, YIN Shaowu, YANG Likun, TONG Lige, LIU Chuanping, WANG Li. Progress of chip-level indirect liquid cooling technology and enhanced heat transfer in data centers[J]. Chemical Industry and Engineering Progress, 2024, 43(11): 6010-6030.

尹瑞, 尹少武, 杨立坤, 童莉葛, 刘传平, 王立. 数据中心芯片级间接液冷技术与强化传热进展[J]. 化工进展, 2024, 43(11): 6010-6030.

Figures/Tables 19

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液冷方式	实现方式	冷媒工质
直接接触式
喷淋式	液体定向喷淋到主要发热元件上，带走热量	硅油、矿物油、氟化液
浸没式	服务器浸没在冷却液中，通过液体流动散热	硅油、矿物油、氟化液
间接接触式
单相冷却	循环冷却剂在冷板内流动，利用显热带走热量	纯水、氟化液、醇类液体
两相冷却	循环冷却剂发生液-气相变，利用显热及潜热带走热量	低沸点的介质流体和制冷剂
热管冷却	由热源和散热器之间的温差驱动传热，使发热元件的热量发生空间转移	热管冷却剂：水、甲醇、丙酮、氨、R141b、 NF、SiO₂-H₂O；冷凝器冷却剂：空气、水

液冷方式	实现方式	冷媒工质
直接接触式
喷淋式	液体定向喷淋到主要发热元件上，带走热量	硅油、矿物油、氟化液
浸没式	服务器浸没在冷却液中，通过液体流动散热	硅油、矿物油、氟化液
间接接触式
单相冷却	循环冷却剂在冷板内流动，利用显热带走热量	纯水、氟化液、醇类液体
两相冷却	循环冷却剂发生液-气相变，利用显热及潜热带走热量	低沸点的介质流体和制冷剂
热管冷却	由热源和散热器之间的温差驱动传热，使发热元件的热量发生空间转移	热管冷却剂：水、甲醇、丙酮、氨、R141b、 NF、SiO₂-H₂O；冷凝器冷却剂：空气、水

技术	强化方式	实现途径	结果
单相、两相冷却	调整冷却流体	改变流速；改变冷却液种类，添加纳米材料等；调整充液率	调整流体热性能和水动力性能，改善换热能力
	改善流道	常规、仿生、拓扑优化结构；改变尺寸参数	改变流体水动力性能，影响均温性及散热效果
	改变壳体材质	高导热性材料；多孔材料；表面处理	调整界面热阻及换热效果
	改变操作环境	磁场；放置方向	影响流动及换热
热管冷却	调整工作流体	调整充液率；改变管内工质	影响换热能力、应对失效性问题
热管冷却	改变形状或布置方式	L、H、U等形状；调整热管倾角	影响散热器整体热阻及CPU冷却效果
耦合技术	单相冷却+热管冷却	热管冷凝段使用冷板换热	快速导出的热量被冷板高效散出
	热管冷却+相变材料	将热管埋入相变材料或用相变材料环绕	快速导热的同时，均衡被冷却元件的温度
	单相冷却+相变材料	将相变材料添加到冷板附近	均衡温度的同时，将热量高效带出
	热管/冷板+TEG	利用温差在冷却系统中添加TEG	回收能量，节能

技术	强化方式	实现途径	结果
单相、两相冷却	调整冷却流体	改变流速；改变冷却液种类，添加纳米材料等；调整充液率	调整流体热性能和水动力性能，改善换热能力
	改善流道	常规、仿生、拓扑优化结构；改变尺寸参数	改变流体水动力性能，影响均温性及散热效果
	改变壳体材质	高导热性材料；多孔材料；表面处理	调整界面热阻及换热效果
	改变操作环境	磁场；放置方向	影响流动及换热
热管冷却	调整工作流体	调整充液率；改变管内工质	影响换热能力、应对失效性问题
热管冷却	改变形状或布置方式	L、H、U等形状；调整热管倾角	影响散热器整体热阻及CPU冷却效果
耦合技术	单相冷却+热管冷却	热管冷凝段使用冷板换热	快速导出的热量被冷板高效散出
	热管冷却+相变材料	将热管埋入相变材料或用相变材料环绕	快速导热的同时，均衡被冷却元件的温度
	单相冷却+相变材料	将相变材料添加到冷板附近	均衡温度的同时，将热量高效带出
	热管/冷板+TEG	利用温差在冷却系统中添加TEG	回收能量，节能

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