[1] Yousefi T, Mousavi S A, Farahbakhsh B, et al.Experimental investigation on the performance of CPU coolers:Effect of heat pipe inclination angle and the use of nanofluids[J].Microelectronics Reliability, 2013, 53(12):1954-1961.[2] Alfieri F, Gianini S, Tiwari M K, et al.Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling[J].Numerical Heat Transfer Part A-Applications, 2014, 65(3):201-215.[3] Brighenti F, Kamaruzaman N, Brandner J J.Investigation of self-similar heat sinks for liquid cooled electronics[J].Applied Thermal Engineering, 2013, 59(1-2):725-732.[4] Zhang J R, Zhang T T, Prakash S, et al.Experimental and numerical study of transient electronic chip cooling by liquid flow in microchannel heat sinks[J].Numerical Heat Transfer, Part A, 2014, 65(7):627-643.[5] Liu J J, Zhang H, Yao S C, et al.Porous media modeling of two-phase microchannel cooling of electronic chips with nonuniform power distribution[J].Journal of Electronic Packaging, 2014, 136(2):1-9.[6] Fylladitakis E D, Moronis A X, Kiousis K.Design of a prototype EHD air pump for electronic chip cooling applications[J].Plasma Science and Technology, 2014, 16(5):491-501.[7] Meng J H, Wang X D, Zhang X X.Transient modeling and dynamic characteristics of thermoelectric cooler[J].Applied Energy, 2013, 108:340-348.[8] Semenyuk V.Heat sinks for miniature thermoelectric coolers:Selection and characterization[J].Journal of Electronic Materials, 2014, 43(6):2452-2458.[9] Martinez A, Astrain D, Rodriguez A, et al.Thermoelectric self-cooling system to protect solar collectors from overheating[J].Journal of Electronic Materials, 2014, 43(6):1480-1486.[10] Gallo A, Arana A, Oyanguren A, et al.Numerical modeling and design of thermoelectric cooling systems and its application to manufacturing machines[J].Journal of Electronic Materials, 2013, 42(7):2287-2291.[11] Semenyuk V, Dekhtiaruk R.Novel thermoelectric modules for cooling powerful LEDs:Experimental results[J].Journal of Electronic Materials, 2013, 42(7):2227-2232.[12] Zuo Z, Luo Q H.Experiment on performances of a thermoelectric cooler for electronic cooling[J].Applied Mechanics and Materials, 2013, 256-259:2632-2635.[13] Redmond M, Manickaraj K, Sullivan O, et al.Hotspot cooling in stacked chips using thermoelectric coolers[J].IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3(5):759-767.[14] Campbell L, Wright L.Analysis and testing of a thermoelectric heat exchanger configured for cooling a processor module heat load[C]//2013 Twenty Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm).San Jose, CA:IEEE, 2013:93-98.[15] 张平, 宣益民, 李强.界面接触热阻的研究进展[J].化工学报, 2012, 63(2):335-349.[16] Sharma S, Dwivedi V K, Pandit S N.A review of thermoelectric devices for cooling applications[J].International Journal of Green Energy, 2014, 11(9):899-909.[17] Seifert W, Pluschke V, Hinsche N F.Thermoelectric cooler concepts and the limit for maximum cooling[J].Journal of Physics:Condensed Matter, 2014, 26(25):255803.[18] 徐高卫, 薛建顺, 程迎军, 等.超级计算机机箱的热流场特性研究和优化设计[J].机械设计与研究, 2006, 22(6):57-61.[19] 王亚雄, 田智凤, 韩晓星.多触点集成平板热管散热器的性能[J].化工进展, 2012, 31(8):1707-1710.[20] Yilbas B S, Sahin A Z.Thermal characteristics of combined thermoelectric generator and refrigeration cycle[J].Energy Conversion and Management, 2014, 83:42-47.[21] 邱泽正, 龚宇烈, 马伟斌, 等.国内外吸收压缩式热泵研究进展[J].化工进展, 2011, 30(2):264-268. |