基于金字塔形扰动结构的双层梯形微通道热沉传热性能模拟

doi:10.16085/j.issn.1000-6613.2020-1101

摘要/Abstract

摘要：

随着电子器件功率的不断增加，其热流密度也相应提高。良好的热管理是保证电子器件安全平稳运行的重要条件。基于Hosseinpour与Sharma等的研究结果，本文设计了一种金字塔形扰动结构的双层微通道热沉，提高了微通道热沉换热能力。选取去离子水作为换热介质，通过数值模拟的方法建立并分析了基于金字塔形扰动结构的双层梯形微通道热沉模型，得出优化结构尺寸。研究表明，当微通道热沉流体雷诺数在468附近、扰动结构间距在300μm附近、扰动结构底高比在0.6附近时，该微通道热沉具有相比其他工况较优的换热性能；在Re=800的相同条件下，本文与Sharma等的研究结果相比，微通道热沉总热阻降低了26%；与普通双层梯形微通道热沉相比，具有金字塔型扰动结构的双层梯形微通道热沉的强化传热系数PEC为1.28。

关键词: 微通道, 传热, 优化设计, 模型, 数值模拟

Abstract:

As the power of electronic device continues to increase, the heat flux density has also increased accordingly. Good thermal management is an important condition to ensure the safe and stable operation of electronic device. Based on the research results of Hosseinpour, et al and Sharma, et al, a double-layer microchannel heat sink with a pyramidal turbulence structure was designed, the heat transfer capacity of the microchannel heat sink is improved. Deionized water was selected as working medium flow, the double-layer trapezoidal microchannel heat sink model based on the pyramidal turbulence structure was established and analyzed by numerical simulation, the optimized structure size was obtained. The research shows that the microchannel heat sink has better heat transfer performance than other working conditions when the Reynolds number of the microchannel heat sink fluid is near 468, the distance between the disturbing structures is near 300μm, and the bottom-height ratio of the disturbing structure is near 0.6. Under the same conditions which Reynolds number is 800, compared with the results of Sharma, et al, the total heat resistance of the microchannel heat sink is reduced by 26%; compared with the ordinary double-layer trapezoidal microchannel heat sink, the double layer with pyramidal turbulence structure. The enhanced heat transfer coefficient PEC of the double-layer trapezoidal microchannel heat sink with pyramidal turbulence structure is 1.28.

Key words: microchannels, heat transfer, optimal design, model, numerical simulation

中图分类号:

TK124

陈然, 唐晟. 基于金字塔形扰动结构的双层梯形微通道热沉传热性能模拟[J]. 化工进展, 2020, 39(S2): 19-25.

Ran CHEN, Sheng TANG. Heat transfer performance simulation of double-layer trapezoidal microchannel heat sink based on pyramidal turbulence structure[J]. Chemical Industry and Engineering Progress, 2020, 39(S2): 19-25.

图/表 8

参考文献 16

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参数名称	数值
晶体硅密度ρ_s	2330kg/m³
晶体硅比热容C_s	700kJ/(kg?K)
晶体硅热导率K_s	148W/(m?K)
去离子水密度ρ_f	996.5kg/m³
去离子水比热C_p,f	4.177kJ/(kg?K)
去离子水热导率K_f	0.612W/(m?K)
去离子水动力黏度系数μ_f	8.623×10^-4Pa·s

参数名称	数值
晶体硅密度ρ_s	2330kg/m³
晶体硅比热容C_s	700kJ/(kg?K)
晶体硅热导率K_s	148W/(m?K)
去离子水密度ρ_f	996.5kg/m³
去离子水比热C_p,f	4.177kJ/(kg?K)
去离子水热导率K_f	0.612W/(m?K)
去离子水动力黏度系数μ_f	8.623×10^-4Pa·s

项目	网格数168940	E/%	网格数314157	E/%	最大网格数816092
?P/Pa	600.08	5.6	632.62	0.4	635.43
T_max/K	307.82	0.6	306.21	0.1	305.95
T_avg/K	306.13	0.5	304.76	0.1	304.49

项目	网格数168940	E/%	网格数314157	E/%	最大网格数816092
?P/Pa	600.08	5.6	632.62	0.4	635.43
T_max/K	307.82	0.6	306.21	0.1	305.95
T_avg/K	306.13	0.5	304.76	0.1	304.49

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