Chemical Industry and Engineering Progress ›› 2021, Vol. 40 ›› Issue (3): 1384-1394.DOI: 10.16085/j.issn.1000-6613.2020-0889
• Industrial catalysis • Previous Articles Next Articles
Received:
2020-05-22
Online:
2021-03-17
Published:
2021-03-05
Contact:
FAN Yu
通讯作者:
范煜
作者简介:
苏文礼(1995—),男,博士研究生,研究方向为能源转化与优化利用。E-mail:CLC Number:
SU Wenli, FAN Yu. Progress of electrocatalytic reduction of CO2 on metal-based materials[J]. Chemical Industry and Engineering Progress, 2021, 40(3): 1384-1394.
苏文礼, 范煜. 金属基材料电催化CO2还原的研究进展[J]. 化工进展, 2021, 40(3): 1384-1394.
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电化学半反应 | 电极电位(vs. SHE)/V |
---|---|
2H++2e- | -0.42 |
CO2+2H++2e- | -0.52 |
CO2+2H++2e- | -0.61 |
CO2+4H++4e- | -0.51 |
CO2+6H++6e- | -0.38 |
CO2+8H++8e- | -0.24 |
2CO2+12H++12e- | 0.064 |
2CO2+12H++12e- | 0.084 |
电化学半反应 | 电极电位(vs. SHE)/V |
---|---|
2H++2e- | -0.42 |
CO2+2H++2e- | -0.52 |
CO2+2H++2e- | -0.61 |
CO2+4H++4e- | -0.51 |
CO2+6H++6e- | -0.38 |
CO2+8H++8e- | -0.24 |
2CO2+12H++12e- | 0.064 |
2CO2+12H++12e- | 0.084 |
催化剂 | 电解质 | 电位(vs. RHE)/V | 电流密度/mA·cm-2 | 主要产物(FE) | 稳定性/h | 参考文献 |
---|---|---|---|---|---|---|
Cu NCs | 0.1mol·L-1 KHCO3 | -1.1 | 5.6 | C2H4(41%) | — | [ |
Cu基 NP/C | 0.1mol·L-1 KHCO3 | -1.1 | 约60mA·mgCu-1 | C2H4(57.3%) | 10 | [ |
CuOx颗粒 | 0.1mol·L-1 CsHCO3 | -0.9 | 11 | C2+(80%) | 3 | [ |
Au NWs | 0.5mol·L-1 KHCO3 | -0.35 | 1.84A·gAu-1 | CO(94%) | 6 | [ |
Cu NWs | 0.1mol·L-1 KHCO3 | -1.25 | 约15 | CH4(55%) | — | [ |
2D Cu纳米片 | 2mol·L-1 KOH | -0.74 | 约272 | C2+(70%),其中CH3COO-(48%) | 3 | [ |
3D Cu NFs | 0.1mol·L-1 KHCO3 | -1.0~-1.6 | 18.7~21 | HCOOH(45%) | 9 | [ |
3D hp-In | 0.1mol·L-1 KHCO3 | -1.2 | 65.7 | HCOOH(90%) | 24 | [ |
Cu-In合金 | 0.1mol·L-1 KHCO3 | -0.7 | 约1.6 | CO(95%) | 7 | [ |
CuPd合金 | 0.5mol·L-1 KHCO3 | -0.87 | 约4.5 | CO(88%) | 20 | [ |
Sn-Cu合金 | 0.5mol·L-1 KCl | -1.14 | 约100 | HCOOH(82.3%) | 11 | [ |
In-Zn NCs | 0.5mol·L-1 KHCO3 | -1.2 | 22 | HCOOH(95%) | 24 | [ |
Cu-Ag合金 | 1mol·L-1 KOH | -0.7 | 约300 | C2H4(60%),C2H5OH(25%) | — | [ |
AuCu/Cu-SCA | 0.5mol·L-1 KHCO3 | -1.0 | 约19 | C2H5OH(29%),C2H4(16%) | 24 | [ |
OD-Au | 0.5mol·L-1 NaHCO3 | -0.35 | 2~4 | CO(96%) | 8 | [ |
Cu2O薄膜 | 0.1mol·L-1 KHCO3 | -0.99 | 30~35 | C2H4(34%~39%),C2H5OH(9%~16%) | — | [ |
OD-Cu | 0.1mol·L-1 KHCO3 | -0.9 | 11 | C2H4(60%) | — | [ |
等离子体处理的Cu | 0.1mol·L-1 KHCO3 | -1.0 | 约34 | C2H4(45%),C2H5OH(22%) | — | [ |
Cu/CNS | 0.1mol·L-1 KHCO3 | -1.2 | 2 | C2H5OH(63%) | 6 | [ |
In2O3-rGO | 0.1mol·L-1 KHCO3 | -1.2 | 26 | HCOOH(84.6%) | 10 | [ |
Ag-G-NCF | 0.1mol·L-1 KHCO3 | -0.6 | 0.31 | C2H5OH (85.2%) | 10 | [ |
Cu Ps/BCF | 0.1mol·L-1 KHCO3 | -1.0 | 50 | C2H4(63.7%) | 24 | [ |
Ni SAs/N-C | 0.5mol·L-1 KHCO3 | -1.0 | 10.48 | CO(71%) | 60 | [ |
Ni-N-C | 0.1mol·L-1 KHCO3 | -0.75 | 7.51 | CO(96%) | 10 | [ |
Co-N2 | 0.5mol·L-1 KHCO3 | -0.68 | 18.1 | CO(95%) | 60 | [ |
Ni-NG | 0.5mol·L-1 KHCO3 | -0.65 | 约11 | CO(95%) | 20 | [ |
SANi-GO | 0.5mol·L-1 KHCO3 | -0.63 | 约21 | CO(96.5%) | 50 | [ |
催化剂 | 电解质 | 电位(vs. RHE)/V | 电流密度/mA·cm-2 | 主要产物(FE) | 稳定性/h | 参考文献 |
---|---|---|---|---|---|---|
Cu NCs | 0.1mol·L-1 KHCO3 | -1.1 | 5.6 | C2H4(41%) | — | [ |
Cu基 NP/C | 0.1mol·L-1 KHCO3 | -1.1 | 约60mA·mgCu-1 | C2H4(57.3%) | 10 | [ |
CuOx颗粒 | 0.1mol·L-1 CsHCO3 | -0.9 | 11 | C2+(80%) | 3 | [ |
Au NWs | 0.5mol·L-1 KHCO3 | -0.35 | 1.84A·gAu-1 | CO(94%) | 6 | [ |
Cu NWs | 0.1mol·L-1 KHCO3 | -1.25 | 约15 | CH4(55%) | — | [ |
2D Cu纳米片 | 2mol·L-1 KOH | -0.74 | 约272 | C2+(70%),其中CH3COO-(48%) | 3 | [ |
3D Cu NFs | 0.1mol·L-1 KHCO3 | -1.0~-1.6 | 18.7~21 | HCOOH(45%) | 9 | [ |
3D hp-In | 0.1mol·L-1 KHCO3 | -1.2 | 65.7 | HCOOH(90%) | 24 | [ |
Cu-In合金 | 0.1mol·L-1 KHCO3 | -0.7 | 约1.6 | CO(95%) | 7 | [ |
CuPd合金 | 0.5mol·L-1 KHCO3 | -0.87 | 约4.5 | CO(88%) | 20 | [ |
Sn-Cu合金 | 0.5mol·L-1 KCl | -1.14 | 约100 | HCOOH(82.3%) | 11 | [ |
In-Zn NCs | 0.5mol·L-1 KHCO3 | -1.2 | 22 | HCOOH(95%) | 24 | [ |
Cu-Ag合金 | 1mol·L-1 KOH | -0.7 | 约300 | C2H4(60%),C2H5OH(25%) | — | [ |
AuCu/Cu-SCA | 0.5mol·L-1 KHCO3 | -1.0 | 约19 | C2H5OH(29%),C2H4(16%) | 24 | [ |
OD-Au | 0.5mol·L-1 NaHCO3 | -0.35 | 2~4 | CO(96%) | 8 | [ |
Cu2O薄膜 | 0.1mol·L-1 KHCO3 | -0.99 | 30~35 | C2H4(34%~39%),C2H5OH(9%~16%) | — | [ |
OD-Cu | 0.1mol·L-1 KHCO3 | -0.9 | 11 | C2H4(60%) | — | [ |
等离子体处理的Cu | 0.1mol·L-1 KHCO3 | -1.0 | 约34 | C2H4(45%),C2H5OH(22%) | — | [ |
Cu/CNS | 0.1mol·L-1 KHCO3 | -1.2 | 2 | C2H5OH(63%) | 6 | [ |
In2O3-rGO | 0.1mol·L-1 KHCO3 | -1.2 | 26 | HCOOH(84.6%) | 10 | [ |
Ag-G-NCF | 0.1mol·L-1 KHCO3 | -0.6 | 0.31 | C2H5OH (85.2%) | 10 | [ |
Cu Ps/BCF | 0.1mol·L-1 KHCO3 | -1.0 | 50 | C2H4(63.7%) | 24 | [ |
Ni SAs/N-C | 0.5mol·L-1 KHCO3 | -1.0 | 10.48 | CO(71%) | 60 | [ |
Ni-N-C | 0.1mol·L-1 KHCO3 | -0.75 | 7.51 | CO(96%) | 10 | [ |
Co-N2 | 0.5mol·L-1 KHCO3 | -0.68 | 18.1 | CO(95%) | 60 | [ |
Ni-NG | 0.5mol·L-1 KHCO3 | -0.65 | 约11 | CO(95%) | 20 | [ |
SANi-GO | 0.5mol·L-1 KHCO3 | -0.63 | 约21 | CO(96.5%) | 50 | [ |
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