Abstract:

The composite material with three-dimensional (3D) packing network has excellent thermal conductivity, which is one of the ideal materials to solve the problem of heat dissipation of electronic devices and is widely used in the field of thermal insulation materials. This paper described the important research progress of 3D thermal insulating polymer materials at home and abroad in recent years. Firstly, starting from the preparation method of 3D filler structure, it introduced the main ways to prepare 3D thermal insulating composite materials, including template method, foam method, 3D printing method, composite particle method and polymer frame method, and analyzed the forming mechanism of different construction methods. The advantages and disadvantages of each preparation method were introduced. Secondly, the finite element simulation of 3D heat conduction network was summarized, and the heat conduction models commonly used at present were analyzed. Finally, the bottleneck and future development direction in the preparation of thermal insulating composite materials with 3D network structure were described, including the elaboration and free construction of 3D filler network, the treatment of the interface thermal resistance between 3D filler structure and polymer, the establishment of a general heat conduction model of 3D filler network and the reduction of process difficulty. It provided the direction and idea for the research and application of high thermal conductivity insulating composites.

Key words: heat conduction, insulation, composites, fillers, simulation

摘要：

具有三维（3D）填料网络的复合材料导热性能优异，是解决电子器件散热问题的理想材料之一，被广泛应用于导热绝缘材料领域。本文阐述了近年来国内外关于3D导热绝缘高分子材料的重要研究进展，首先从3D填料架构的制备方式出发，介绍了制备3D导热绝缘复合材料的主流途径，包括模板法、泡沫法、3D打印法、复合颗粒法和聚合物框架法等，分析了不同构筑方法的成型机理，并对各制备方法的优缺点进行了归纳和总结；其次对关于3D导热网络的有限元模拟研究进行了总结，分析了目前常用的热传导模型；最后对制备具有3D网络结构的导热绝缘复合材料研究工作中面临的瓶颈和未来发展方向进行了阐述，主要包括3D填料网络的精细化和自由化的构建、3D填料架构与聚合物间界面热阻的处理、3D填料网络通用热传导模型的建立以及3D填料结构制备工艺的简化。以期为高导热绝缘复合材料的研发和应用提供方向和思路。

关键词: 热传导, 绝缘, 复合材料, 填料, 模拟