Abstract: Based on CAI-temperature integral approximation, more accurate than traditional FWO temperature integral approximation, and Levenberg-Marquardt nonlinear regression, the kinetic parameters of two kinds of PCB respectively were simulated with 1st Opt universal global optimization mathematic software. Pyrolysis experiment was implemented in thermogravimetric analyser (TGA) and the results were compared with kinetic model study. The results showed that：①The apparent activation energy , the pre-exponential factor , and reaction order were 250.0 kJ/mol, 9.495×1019 min?1, 7.0 for FR4-type PCB; 183.42 kJ/molkJ/mol, 8.250×1010 min?1, 0 for Telfon-type PCB. ② The models for Telfon-type PCB were in good agreement with the experimental results. The models for FR4-type PCB agreed quite well with the experimental data in the main pyrolysis temperature zone, but showed some differentiation after thermogravimetric loss rate was less than 0.2.

Key words: printed circuit board, pyrolysis, kinetic model, universal global optimization

摘要： 在探讨废弃印刷线路板热解表观动力学模型时，提出采用蔡式温度积分式实现温度积分的解析解求解，避免了传统FWO温度积分近似式对温度积分展开式高阶项的省略，提高计算精度。采用Levenberg-Marqurdt优化非线性回归方法，运用1stOpt通用全局优化数值计算软件实现热解动力学三因子表观活化能、指前因子、反应级数等参数的求解。研究结果表明：①FR4型印刷线路板表观动力学三因子活化能为250.0 kJ/mol，指前因子为9.495×1019 min－1，反应级数约为7.0；Teflon型印刷线路板表观动力学三因子活化能为183.42 kJ/mol，指前因子8.250×1010 min－1，反应级数约为零。②Teflon型印刷线路板求解的热解模型与实验结果近乎完美性一致，FR4型线路板在主要热解温区内获得很好的预测结果。在失重率小于0.2之后的温度区域存在一定的偏差。

关键词: 印刷线路板, 热解, 动力学模型, 通用全局优化数值计算