Application progress of nano copper conductive ink in PCB

doi:10.16085/j.issn.1000-6613.2021-0216

Abstract

Abstract:

In recent years, with the development of the electronics industry, people have begun to pay more attention to the application of nanomaterials in electronic printed circuit boards (printed circuit board, referred to as PCB). New, efficient, economical, and environmentally friendly technical methods have gradually replaced traditional manufacturing processes. This article reviews the preparation methods of different kinds of nano-material conductive inks and the development of new printed circuit board preparation technologies. By comparing the effects of different reactants, additives and different methods on the properties of the final nano-copper conductive inks, the adaptation is introduced. Preparation technology of nano materials for different requirements. In addition, the influence of different sintering processes and printing processes on the final PCB circuit generation is introduced. Compared with the disadvantages of traditional copper-clad laminate etching circuit technology, such as high pollution, material waste, and complex process, the new process combines the properties of nano materials, uses high-precision equipment, and focuses on the direction of low cost, less pollution, short time, and low energy consumption. A series of studies, and discussed the future development direction of the PCB industry in 5G applications and possible opportunities and challenges.

Key words: nanomaterials, inkjet printing, sintering, environment, printed circuit board(PCB), 5th-generation (5G)

摘要：

近年来，随着电子行业的发展，人们更多开始关注纳米材料在电子印刷电路板（printed circuit board，PCB）中的应用，新型、高效、经济、环保的技术方法逐渐替代传统制造工艺。本文综述了不同种纳米材料导电墨水的制备方法和新型印制电路板制备技术的发展，通过对比不同反应物、添加剂以及不同方法对最终生成的纳米铜导电墨水性能的影响，针对性介绍了适应于不同要求的纳米材料制备工艺技术。此外，介绍了不同的烧结工艺和打印工艺对最终生成PCB线路的影响。相对于传统的覆铜板刻蚀电路技术污染大、材料浪费、工艺复杂等缺点，新工艺结合纳米材料性能，利用高精度设备，着重向低成本、少污染、时间短、能耗低的方向进行一系列研究，文章还讨论了未来PCB行业在5G的应用发展方向和可能遇到的机遇和挑战。

关键词: 纳米材料, 喷墨打印, 烧结, 环境, 印刷电路板, 第五代移动通信技术

CLC Number:

TB34

WANG Xiaofang, CHEN Jiamiao, LU Jiasheng, LUO Jiye, JI Shaomin, HUO Yanping, ZHAO Jingwei, FANG Yanxiong. Application progress of nano copper conductive ink in PCB[J]. Chemical Industry and Engineering Progress, 2021, 40(S1): 270-280.

王晓芳, 陈嘉苗, 陆嘉晟, 罗继业, 籍少敏, 霍延平, 赵经纬, 方岩雄. 纳米铜导电墨水在电子印刷线路板制备中的应用进展[J]. 化工进展, 2021, 40(S1): 270-280.

Figures/Tables 11

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金属	电阻率/μΩ·cm^-1	熔点/℃	价格/CNY·g^-1
金	2.40	1064	250~550
银	1.65	961	4~6
铜	1.75	1084	0.027~0.052

金属	电阻率/μΩ·cm^-1	熔点/℃	价格/CNY·g^-1
金	2.40	1064	250~550
银	1.65	961	4~6
铜	1.75	1084	0.027~0.052

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