化工进展 ›› 2022, Vol. 41 ›› Issue (8): 4473-4480.DOI: 10.16085/j.issn.1000-6613.2021-1945

• 精细化工 • 上一篇    下一篇

硅改性BPA-PA酚醛环氧树脂导电胶的合成及性能

郭睿(), 李平安(), 赵云飞   

  1. 陕西科技大学教育部轻化工助剂化学与技术重点实验室,陕西 西安 710021
  • 收稿日期:2021-09-10 修回日期:2021-11-01 出版日期:2022-08-25 发布日期:2022-08-22
  • 通讯作者: 李平安
  • 作者简介:郭睿(1959—),男,教授,硕士生导师,研究方向为精细、能源化学品的合成与产品开发。E-mail:gr304@163.com
  • 基金资助:
    陕西省重点研发计划(2017GY-185);西安市科技计划(CXY1701(3))

Synthesis and performance of silicon modified BPA-PA phenolic epoxy resin conductive adhesive

GUO Rui(), LI Ping’an(), ZHAO Yunfei   

  1. Key Laboratory of Auxiliary Chemistry and Technology for Light Chemicals, Ministry of Education, Shaanxi University of Science and Technology, Xi’an 710021, Shaanxi, China
  • Received:2021-09-10 Revised:2021-11-01 Online:2022-08-25 Published:2022-08-22
  • Contact: LI Ping’an

摘要:

以双酚A多聚甲醛酚醛树脂(BPA-PA酚醛树脂)、二甲基二甲氧基硅烷和环氧氯丙烷为原料,通过酯交换反应和亲核取代反应得到硅改性BPA-PA酚醛环氧树脂。采用傅里叶变换红外光谱(FTIR)、X射线光电子能谱(XPS)分析进行结构确证。结合非等温DSC、T-β外推直线和FTIR分析研究了最佳固化工艺条件。探讨了不同硅烷添加量对硅改性BPA-PA酚醛环氧树脂性能的影响。最后以硅改性BPA-PA酚醛环氧树脂为基体树脂,加以导电填料和助剂,制备出中温型导电胶。对导电胶进行拉伸剪切强度、体积电阻率和热重测试分析,结果显示:自制硅改性BPA-PA酚醛环氧树脂导电胶拉伸剪切强度达到20.18MPa、体积电阻率达到7.44×10-4Ω·cm,残炭量达到68.89%。相对市售E-51环氧树脂所制导电胶,自制硅改性BPA-PA酚醛环氧树脂导电胶拉伸剪切强度提高5.73MPa,体积电阻率降低3.86×10-4Ω·cm,残炭量提高7.49%。

关键词: 硅改性, BPA-PA酚醛环氧树脂, 导电胶, 固化工艺条件, 黏结性能, 导电性能, 耐热性能

Abstract:

Using bisphenol A paraformaldehyde phenolic resin (BPA-PA phenolic resin), dimethyldimethoxysilane and epichlorohydrin as raw materials, silicon-modified BPA-PA phenolic epoxy resin was obtained through transesterification and nucleophilic substitution reactions. FTIR and XPS were used for structural confirmation. Combining non-isothermal DSC, T-β extrapolation line and FTIR analysis, the optimal curing process conditions were studied. The effects of different silane addition levels on the properties of silicon-modified BPA-PA phenolic epoxy resin were discussed. Finally, silicon-modified BPA-PA phenolic epoxy resin was used as the matrix resin, and conductive fillers and additives were added to prepare a medium-temperature conductive adhesive. Conduct tensile shear strength, volume resistivity and thermogravimetric test analysis of its conductive adhesive were tested and analyzed. The results showed that the self-made silicon modified BPA-PA phenolic epoxy resin conductive adhesive had a tensile shear strength of 20.18MPa, a volume resistivity of 7.44×10-4Ω·cm and a residual carbon content of 68.89%. Compared with the conductive adhesive made of commercially available E-51 epoxy resin, the self-made silicon-modified BPA-PA phenolic epoxy resin conductive adhesive increased tensile shear strength by 5.73MPa and reduced volume resistivity by 3.86×10-4Ω·cm with increasing amount of residual carbon by 7.49%.

Key words: silicon modified, BPA-PA phenolic epoxy resin, conductive adhesive, curing process conditions, bonding performance, electrical conductivity, heat resistance

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