[1] 何敏,张秋禹,程金奎,等. 保护膜用耐高温溶剂型丙烯酸酯压敏胶的研究[J]. 中国胶剂,2006,15(12):35-38. [2] 何敏,张秋禹,李延锋,等. 压敏胶(带)的可剥离性能的研究进展[J]. 中国胶剂,2008,17(1):44-49. [3] Ward T C,Anne Wood Brinkley,Margaret Sheridan,et al. Block copolymer adhesive studies[J]. Polymer Science and Technology,1984(29):297-310. [4] 易严德. 热塑性弹性体SIS结构与性能的关系[J]. 中国胶剂,2005,14(2):8-11. [5] 何琴玲,林中祥. 不同种类苯乙烯系热塑性弹性体对热熔压敏胶性能影响[J]. 化学与合,2010,32(5):14-27. [6] 李陵岚,叶楚平. 包装用胶剂及接技术[M]. 北京:化学工业出版社,2005:106-108. [7] Katsuhiko Horigome,Kazuyoshi Ebe,Shin-ichi Kuroda. UV curable pressure sensitive adhesives for fabricating semiconductors. Ⅱ. The effect of functionality of acrylate monomers on the adhesive mesoporous silica nanospheres[J]. Journal of Applied Polymer Science,2004(93):2889-2895. [8] Kazuyoshi Ebe,Hideo Seno,Katsuhiko Horigome. UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes[J]. Journal of Applied Polymer Science,2003(90):436-441. [9] Zhang X W,Pan Y,Zheng Q,et al. Polystyrene/Sn-Pb,alloy blends.Ⅰ.Dynamic rheological behavior[J]. J. AppI. Polym. Sci.,2002,86:3166-3127. [10] Zheng Q,Du M,Yang B B,et al. Relationship between dynamic rheological behavior and phase separation of poly(methyl methacrylate)/poly(styrene-co-acrylonitrile) blends polymer[J]. Polymer,2001,42(13):5743-5747. |