1 |
VAŠKELIS A, NORKUS E, JAČIAUSKIENĖ J. Kinetics of electroless copper deposition using cobalt(Ⅱ)-ethylenediamine complex compounds as reducing agents[J]. Journal of Applied Electrochemistry, 2002, 32(3): 297-303.
|
2 |
崔国峰, 李宁, 黎德育. 化学镀铜在微电子领域中的应用及展望[J]. 电镀与环保, 2003, 23(5): 5-7.
|
|
CUI Guofeng, LI Ning, LI Deyu. Applications and prospects of electroless Cu plating in microelectronic field[J]. Electroplating & Pollution Control, 2003, 23(5): 5-7.
|
3 |
XU H, LI Bo, WEI Yonggang, et al. Extracting of copper from simulated leaching solution of copper-cadmium residues by cyclone electrowinning technology[J]. Hydrometallurgy, 2020, 194: 105298.
|
4 |
邹勇斌, 龚维辉, 李浩, 等. 电镀废水处理技术的研究[J]. 广东化工, 2014, 41(11): 200-202.
|
|
ZOU Yongbin, GONG Weihui, LI Hao, et al. Research on electroplating wastewater treatment technology[J]. Guangdong Chemical Industry, 2014, 41(11): 200-201.
|
5 |
HU Xuewei, HU Yuanwei, CHEN Kai, et al. Treatment of simulation of copper-containing pit wastewater with sulfate-reducing bacteria (SRB) in biofilm reactors[J]. Environmental Earth Sciences, 2016, 75(19): 1-10.
|
6 |
DONG Yue, LIU Junfeng, SUI Mingrui, et al. A combined microbial desalination cell and electrodialysis system for copper-containing wastewater treatment and high-salinity-water desalination[J]. Journal of Hazardous Materials, 2017, 321: 307-315.
|
7 |
LIU Xuheng, HE Yang, ZHAO Zhongwei, et al. Study on removal of copper from nickel‑copper mixed solution by membrane electrolysis[J]. Hydrometallurgy, 2018, 180: 153-157.
|
8 |
TRAN T K, LEU H J, CHIU K F, et al. Electrochemical treatment of heavy metal-containing wastewater with the removal of COD and heavy metal ions[J]. Journal of the Chinese Chemical Society, 2017, 64(5): 493-502.
|
9 |
曾淼, 冯凯莉, 叶晨皓, 等. 电解法处理电镀含铜废水的实验研究[J]. 电镀与精饰, 2016, 38(11): 43-46.
|
|
ZENG Miao, FENG Kaili, YE Chenhao, et al. Treatment of copper-containing wastewater by electrolysis method[J]. Plating & Finishing, 2016, 38(11): 43-46.
|
10 |
DAEHN K, ALLANORE A. Electrolytic production of copper from chalcopyrite[J]. Current Opinion in Electrochemistry, 2020, 22: 110-119.
|
11 |
李韬, 王三反, 周键. 离子膜电解法电沉积回收硫酸镍体系中金属镍的实验研究[J]. 材料导报, 2016, 30(S2): 432-435, 439.
|
|
LI Tao, WANG Sanfan, ZHOU Jian. Experimental study of ion-exchange membrane electrolysis nickel sulfate electrowinning of nickel metal system[J]. Materials Review, 2016, 30(S2): 432-435, 439.
|
12 |
范帅. 电镀废水中铜的电沉积回收及其工艺设计[D]. 衡阳: 南华大学, 2015.
|
|
FAN Shuai. Research and design of electrodeposition recovery of copper from electroplating wastewater[D]. Hengyang: University of South China, 2015.
|
13 |
SNIEKERS J, GEYSENS P, HOOGERSTRAETE T V, et al. Cobalt(ii) liquid metal salts for high current density electrodeposition of cobalt[J]. Dalton Transactions, 2018, 47(14): 4975-4986.
|
14 |
郑凡, 黄炳行, 闭伟宁, 等. 阴离子交换膜无硒电解金属锰工艺及工业可行性探索[J]. 中国锰业, 2016, 34(5): 75-78.
|
|
ZHENG Fan, HUANG Bingxing, BI Weining, et al. A study on non-selenium electrolytic process with anion exchange membrane electrolyzer[J]. China's Manganese Industry, 2016, 34(5): 75-78.
|
15 |
SAHU S K, CHMIELOWIEC B, ALLANORE A. Electrolytic extraction of copper, molybdenum and rhenium from molten sulfide electrolyte[J]. Electrochimica Acta, 2017, 243: 382-389.
|
16 |
苏亚东. 电沉积对铜晶粒生长的调控及其在电子互连中的应用[D]. 成都: 电子科技大学, 2020.
|
|
SU Yadong. Electrochemical tuning of copper grain growth and its application for electronic interconnection[D]. Chengdu: University of Electronic Science and Technology of China, 2020.
|
17 |
KULEYIN A. Recovery of copper ions from industrial wastewater by electrodeposition[J]. International Journal of Electrochemical Science, 2020, 15: 1474-1485.
|
18 |
WANG Jiqin, HUANG Zhouman, YANG Deze, et al. A semi-scaled experiment for metals separating and recovering from waste printed circuit boards by slurry electrolysis[J]. Process Safety and Environmental Protection, 2021, 147: 37-44.
|
19 |
张昊. 离子膜金属电积生产回收技术及中试研究[D]. 兰州: 兰州交通大学, 2015.
|
|
ZHANG Hao. Research on production recovery process and pilot test from the amberplex metal electrodeposition technology[D]. Lanzhou: Lanzhou Jiatong University, 2015.
|
20 |
NEPEL T C D M, COSTA J M, VIEIRA M G A, et al. Copper removal kinetic from electroplating industry wastewater using pulsed electrodeposition technique[J]. Environmental Technology, 2020: 1-9.
|
21 |
刘香琳. 电沉积法处理模拟含铜废水及其电结晶行为研究[D]. 鞍山: 辽宁科技大学, 2020.
|
|
LIU Xianglin. Study on treatment of simulated copper-containing wastewater by electrodeposition and its crystallization behavior[D]. Anshan: University of Science and Technology Liaoning, 2020.
|
22 |
HABA T, IKEDA K, UOSAKI K. Electrochemical and in situ SERS study of the role of an inhibiting additive in selective electrodeposition of copper in sulfuric acid[J]. Electrochemistry Communications, 2019, 98: 19-22.
|