化工进展

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松香基聚酰胺在各向同性导电胶中的应用

林贵福,聂小安,米 桢   

  1. 中国林业科学研究院林产化学工业研究所;生物质化学利用国家工程实验室;国家林业局林产化学工程重点开放性实验室,江苏 南京 210042
  • 出版日期:2011-05-05 发布日期:2011-05-05

Application of rosin–based polyamide in isotopic conductive adhesive

LIN Guifu,NIE Xiaoan,MI Zhen   

  1. Institute of Chemical Industry of Forest Products,Chinese Academy of Forestry;National Engineering Lab. for Biomass Chemical Utilization;Key and Open Lab. of Forest Chemical Engineering,State Forestry Administration,Nanjing 210042,Jiangsu,China
  • Online:2011-05-05 Published:2011-05-05

摘要:

以马来海松酸酐、二乙烯三胺为原料,合成了松香基聚酰胺,并以其为固化剂,以环氧树脂618为导电胶基体,AgCu粉为导电胶填料,KH560、聚乙二醇(200)为促进剂,制备了AgCu粉导电胶,讨论了各因素对导电胶剪切强度、导电性能的影响,并测定了导电胶的玻璃化温度及耐热性能。结果表明,环氧树脂与松香基聚酰胺在固化质量比为10050.8120 /60 min 条件下可完全固化;AgCu粉的添加量为环氧树脂质量的60%KH560、聚乙二醇添加量分别为AgCu粉质量的3%5%时,导电胶的综合性能最优,此时,导电胶的热分解温度342.1 ,玻璃化温度为144.7

Abstract:

Rosin-based polyamide used as curing agent for conductive adhesivewas prepared from maleopimaric acid anhydride by amidation with diethylenetriaminewith epoxy resin 618 as matrixsilver-coated copper powder as conductive fillerKH560 and PEG200as accelerantand silver-coated copper powder conductive adhesive was prepared. The influences of various factors on the shear strengthconductivity of the conductive adhesive were discussedand its glass transition and heat-resistance were evaluated. The result showed that the resin epoxy/rosin-based polyamide system was cured completely when the mass ratio of resin epoxyrosin-based polyamide was 10050.8 at  120 for 60 minand the addition of silver-coated copper powder was 60% to resin epoxyKH560 and PEG200were 3% and 5% to silver-coated copper powder respectively.Under such conditions the comprehensive performance of the conductive adhesive was optimal. Thermal decomposition temperature was 342.1 and glass transition was 144.7 .

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