Abstract:

Investigation was carried out to elucidate the in?uence of process parameters on the characteristics of chitosan microspheres prepared by reverse phase suspension cross-linked polymerization. The chitosan droplet solidi?ed and hardened by glutaraldehyde crosslinking agent was dispersed in the oil phase composed of liquid paraffin in the presence of Span 80 surfactant. Iminodiacetic acid（IDA）was attached onto chitosan microspheres activated by epichlorohydrin under basic condition. The results indicated that the optimal epoxy density above 0.15 mmol/g gel was achieved at 10%（f）epichlorohydrin as activating accelerator in the solution consisting of 0.6 mol/L NaOH and 40% DMSO. The study on linkaging of IDA demonstrated that the support was synthesized in the solution composed of 0.6 mol/L IDA and 2.0 mol/L NaOH at 60 ℃ for 6 h，whose adsorption of Cu²⁺ was up to 172.787 g/g gel. The moisture content of the matrix was up to 45.60% and the porosity was 69.45% under the optimized conditions. The novel matrix could be used in immobilized metal ion affinity chromatography as the solid phase.

摘要：

以壳聚糖为载体、液体石蜡为分散介质、戊二醛为交联剂、Span80 为乳化剂，采用反相悬浮法制备壳聚糖微球，以环氧氯丙烷为活化剂、亚氨基二乙酸为螯合配基制备新型壳聚糖分离介质，并研究分离介质制备过程中各参数对壳聚糖分离介质性能的影响。确定最佳活化工艺为：40% DMSO/NaOH（0.6 mol/L）、ECH体积分数10%、反应温度40 ℃、反应时间4 h，测得环氧基修饰密度可达到0.15 mmol/g（gel）；最佳螯合工艺：IDA（0.6 mol/L）/ NaOH（2.0 mol/L）混合液，反应时间为6 h，制备的新型壳聚糖分离介质对Cu²⁺吸附量达到172.787 g/g gel，壳聚糖分离介质含水率为45.60%，孔隙率为69.45% ，得到一种新型金属螯合层析填料。