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Advances in application of thermal adaptation composite materials in electronic device cooling

YIN Huibin,GAO Xuenong,DING Jing,ZHANG Zhengguo   

  1. Key Laboratory of Enhanced Heat Transfer and Energy Conservation,Ministry of Education,South China University of Technology; College of Engineering,Sun Yat-Sen University
  • Online:2007-06-25 Published:2007-06-25

热适应复合材料应用于电子器件散热的研究进展

尹辉斌,高学农,丁 静,张正国   

  1. 华南理工大学传热强化与过程节能教育部重点实验室;
    中山大学工学院

Abstract: Thermal adaptation composite materials are composite materials with required thermal conductivity or coefficient of thermal expansion. This paper reviews the research progress of rapid thermal response composite materials with high thermal conductivity and composite materials with controllable coefficient of thermal expansion. The application of thermal adaptation composite materials in electronic device cooling is introduced.

摘要: 热适应复合材料是具有适合要求的热导率或热膨胀系数的一种复合材料。综述了高导热系数的快速热响应复合材料及可控热膨胀系数复合材料的研究进展,并介绍了热适应复合材料在电子器件散热领域的应用。

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