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Heat dissipation of electronics and cooling techniques

MA Yongxi,ZHANG Hong   

  1. School of Mechanical and Power Engineering,Nanjing University of Technology
  • Online:2006-06-25 Published:2006-06-25

电子器件发热与冷却技术

马永锡,张 红   

  1. 南京工业大学机械与动力工程学院

Abstract: The development of electronics depends on the advance of cooling methods. The present situation and trend of heat dissipation of electronic devices are described. At the same time,several advanced cooling techniques,such as improved heat sink cooling,direct immersion cooling,cold plate cooling,heat pipe cooling and thermoelectric cooling are introduced.

摘要: 电子器件的发展依赖于冷却技术的进步。本文分析了当前电子器件发热的最新现状和发展趋势,以及电子技术发展面临的挑战,并介绍了几种先进的冷却技术,如:改进翅片散热、直接浸入式冷却、冷板冷却、热管冷却、热电冷却技术等。

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