Abstract: The problem of heat dissipation is the bottleneck for the further development of micro-devices because the high density,microminiaturization and functional systemic. In this paper,Nano-porous surfaces' excellent phase change heat transfer characteristics were analyzed to solve this problem. An experimental study on the pool boiling heat transfer performance of the aluminum base Al₂O₃ nano-porous film was conducted with water under normal pressure. Experimental results showed that Al₂O₃ nano-porous surface improved the heat transfer coefficient of the aluminum heat transfer surfaces 2—5 times compared with the smooth-surfaced devices,and could maintain high heat transfer coefficient in a long time,because the intensive vaporized core could produce large amount of small bubbles. The surface temperature of microelectronic could be effectively decreased by 3—5℃,even by more than 30℃ in nucleate boiling stage with nano-porous surface as heat transfer surface.

Key words: porous media, heat transfer, alumina, polling boiling, electronic chip cooling

摘要： 目前微电子器件不断地向高密度、微型化、功能化方向发展,散热问题是制约技术进一步发展的瓶颈.本文拟利用纳米多孔表面优良的相变传热特性,解决电子器件微型化散热难的问题.文中以铝基Al₂O₃纳米多孔薄膜为传热表面,以去离子水为工质,常压下对其大容积池沸腾下的传热性能进行了实验研究.实验结果表明:与光滑表面相比,Al₂O₃纳米多孔表面在核态沸腾时汽化核心密集,产生汽泡体积小、数量多并能提高铝基传热表面的传热系数2～5倍,且能够在长时间内维持其较高的传热系数;以纳米多孔表面作为传热表面,可以有效降低微电子原件表面温度3～5℃,在核态沸腾阶段能够降低30℃以上,很好地起到了降低电子元件表面温度的作用.实验结果对微电子冷却有重要的参考作用.

关键词: 多孔介质, 传热, 氧化铝, 池沸腾, 芯片散热