Development of heat pipe cooling technology in high heat flux electronic components

doi:10.16085/j.issn.1000-6613.2015.05.006

Chemical Industry and Engineering Progree ›› 2015, Vol. 34 ›› Issue (05): 1220-1224,1231.DOI: 10.16085/j.issn.1000-6613.2015.05.006

Previous Articles Next Articles

Development of heat pipe cooling technology in high heat flux electronic components

HAO Junjiao¹, PAN Ri¹, ZHOU Gang², ZHANG Yajun¹, ZHUANG Jian¹

1. Polymer Materials Processing Equipment of Engineering Research Center, Beijing University of Chemical Technology, Beijing 100029, China;
2. Ningbo Power Machinery Limited Company, Ningbo 315806, Zhejiang, China

Received:2014-09-22 Revised:2014-10-11 Online:2015-05-05 Published:2015-05-05

高热流密度电子元件中热管散热技术的进展

郝俊娇¹, 潘日¹, 周刚², 张亚军¹, 庄俭¹

1. 北京化工大学高分子材料加工装备教育部工程研究中心, 北京 100029;
2. 宁波力劲机械有限公司, 浙江宁波 315806

通讯作者: 张亚军,教授,博士生导师,从事聚合物微纳制造研究.E-mailzhyj@mail.buct.edu.cn.
作者简介:郝俊娇(1989—),女,硕士研究生,主要从事传热传质研究.E-mailhaojunjiao@yeah.net.
基金资助:
国家博士后基金(20120010120006)、国家自然科学基金(51203010)及北京市自然基金(2131003)重点项目.

Abstract

Abstract: Cooling performance of tradiator is an important factor affecting service life of electronic component and security. Heat pipe is widely used in high heat flux electronic components because of its small size,high cooling capacity and no consumption of power. The overall structure innovations of heat pipe radiator,particularly different arrangements and combinations of heat pipe are summarized,and thermal performance enhancements of heat pipe,including improvement of internal wick structure,complex internal wick structure manufacture are studied. The introduction of nano-fluid for heat transfer improvement is analyzed,and the relevant methods of heat sink thermal performance analysis and parameter optimization are introduced. The development trends and prospects of new structural design concept of heat pipe radiator,nano-fluid model and manufacture of compound liquid-absorbing core are proposed according to analyzing and summarizing research achievements.

Key words: high heat flux, heat pipe radiator, electronic component

摘要： 散热器的散热性能是影响电子元件使用寿命与安全性的重要因素,热管以其空间尺寸小、冷却能力高、无需消耗动力等优点在高热流密度元件的散热技术领域得到广泛应用.文中总结了热管散热器整体结构设计的创新尤其是热管的不同排布和组合,研究了热管元件性能的提高包括热管内部吸液芯的改进、复杂结构吸液芯的制造,分析了纳米流体工质的引入对换热效果的强化,介绍了散热器热性能分析和参数优化的相关方法.通过分析总结国内外研究成果,提出了新概念热管散热器的结构设计、纳米流体理论模型及复合吸液芯的加工制造等方面的发展趋势与展望.

关键词: 高热流密度, 热管散热器, 电子元件

CLC Number:

TK172

HAO Junjiao, PAN Ri, ZHOU Gang, ZHANG Yajun, ZHUANG Jian. Development of heat pipe cooling technology in high heat flux electronic components[J]. Chemical Industry and Engineering Progree, 2015, 34(05): 1220-1224,1231.

郝俊娇, 潘日, 周刚, 张亚军, 庄俭. 高热流密度电子元件中热管散热技术的进展[J]. 化工进展, 2015, 34(05): 1220-1224,1231.

References

[1] McGlen R J,JachuckR,LinS. Integrated thermal management techniques for high power electronic devices[J]. Applied Thermal Engineering,2004,24:1143-1156.

[2] Garimella S V. Advances in mesoscale thermal management technologies for microelectronics[J]. Microelectronics Journal,2006,37(11):1165-1185.

[3] Vasiliev L L. Micro and miniature heat pipes electronic component coolers[J]. Applied Thermal Engineering,2008,28:266-273.

[4] Possamai F C,Setter I,et al. Micro and　miniature heat pipes electronic component coolers[J]. Applied Thermal Engineering,2009,29:3218-3223.

[5] 白敏丽,喜娜,徐哲,等. 新型CPU集成热管散热器的试验研究和CFD辅助设计[J]. 大连理工大学学报,2008,48(2):178-184.

[6] 杨洪武. 微槽群集成热管散热器:中国,200620115025.7[P]. 2007-04-04.

[7] 吴红刚,王文,李庆友. 一种芯片散热型热管的强化传热研究[J]. 科学技术与工程,2006,6(11):1474-1478.

[8] Singh R,Akbarzadeh A,Dixon C,et al. Miniature loop heat pipe with flat evaporator for cooling computer CPU[J]. Components and Packaging Technologies,IEEE Transactions on,2007,30(1): 42-49.

[9] Li Ji,Wang D,Peterson G P. A compact loop heat pipe with flat square evaporator for high power chip cooling[J]. Components,Packaging and Manufacturing Technology,IEEE Transactions on,2011,1(4):519-527.

[10] 诸凯,李媛媛,陆佩强. 用于高热流密度器件冷却的热管散热器实验研究[J]. 低温与超导,2011,39(1):42-46.

[11] 王强,王宏,廖强,等. 大功率集成 LED 热管散热器的传热性能[J]. 热科学与技术,2013(4):312-318.

[12] Jeehoon Choi,Minjoong Jeong,Yoo Junghyun. A new CPU cooler design based on an active cooling heatsink combined with heat pipe[J]. Applied Thermal Engineering,2012,44:50-56.

[13] 王伟涛,陶汉中,徐益. 圆翅片叉排热管散热器流动和传热特性数值分析[J]. 低温与超导,2012,40(7):80-84.

[14] Cotter T P. Theory of heat pipes[R]. Los Alamos Scientific Lab. Report No. LA-3246-MS. 1965.

[15] Xie X L,He Y L,Tao W Q,et al. An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling[J]. Applied Thermal Engineering,2008,28:433-439.

[16] 纪献兵,徐进良,薛强. 超轻多孔泡沫金属平板热管的传热性能研究[J]. 中国电机工程学报,2013,33(2):72-78.

[17] Jiang Lelun,Huang Yong,Tang Yong. Fabrication and thermal performance of porous crack composite wick flattened heat pipe[J]. Energy Conversion and Management,2014,66:140-147.

[18] 韩天. 基于纤维吸液芯结构平板微热管的研究[D]. 哈尔滨:哈尔滨工业大学,2012.

[19] 李勇,陈春燕,曾志新. 纤维复合沟槽吸液芯微热管的传热性能实验[J]. 华南理工大学学报,2013(7):45-49.

[20] 白穜,张红,许辉. 新型组合式吸液芯高温热管传热性能试验研究[J]. 热力发电,2013(5):59-63.

[21] 寇志海,吕洪涛,陈保东,等. 烧结金属毡吸液芯平板热管传热特性试验研究[J]. 热力发电,2014,43(6):51-54,76.

[22] Tsai C Y,Chien H T,Chan B,et al. Effect of structural character of gold nanoparticles in nanofluid on heat pipe thermal performance[J]. Materials Letters,2004,58( 9):1461-1465.

[23] Mousa M G. Effect of nanofluid concentration on the performance of circular heat pipe[J]. Ain Shams Engineering Journal,2011,2(1):63-69.

[24] 宫玉英,赵蔚琳,朱保杰,等. SiO₂-水纳米流体热管传热性能的实验研究[J]. 化工机械,2013(3):302-305.

[25] Solomon A Brusly,Ramachandran K,Godson L,et al. Numerical analysis of a screen mesh wick heat pipe with Cu/water nanofluid[J]. International Journal of Heat and Mass Transfer,2014,75:523-533.

[26] 刁彦华,王瑞,赵耀华,等. TiO₂/R141b纳米流体应用于微槽道结构蒸发器的强化换热特性研究[J]. 工程热物理学报,2013(6):1137-1141.

[27] Wang Jungchang,Hua Hsiangsheng,Chen Sihli. Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes[J]. International Communications in Heat and Mass Transfer,2007,34:958-970.

[28] Liang Tianshen,Hung YewMun. Experimental investigation on the thermal performance and optimizationof heat sink with U-shape heat pipes[J]. Energy Conversion and Management,2010,51:2109-2116.

[29] 杨世铭,陶文铨. 传热学[M]. 第4版. 北京:高等教育出版社,2006:57-65.

[30] 勾昱君,刘中良. 热管换热器应用于大功率 LED 路灯冷却系统的实验研究[J]. 照明工程学报,2012,23(2):37-41.

[31] Tawat Samana,Tanongkiat Kiatsiriroat,Atipoang Nuntaphan. Enhancement of fin efficiency of a solid wire fin by oscillating heat pipe under forced convection[J]. Case StudiesinThermalEngineering,2014(2):36-41.

[32] 寇志海,白敏丽,杨洪武. 平板热管用于笔记本电脑散热的研究[J]. 大连理工大学学报,2011,51(5):658-661.

[33] Yousefi T,Mousavi S A,Farahbakhsh B. Experimental investigation on the performance of CPU coolers:Effect of heat pipe inclination angle and the use of nanofluids[J]. Microelectronics Reliability,2013,53:1954-1961.

[34] Mohamed H A,Zulkifly M,Munusamy S R R. Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling[J]. Components,Packaging and Manufacturing Technology,IEEE Transactions on,2013,3(6):978-988.

[35] Elnaggar M H A,Abdullah M Z,Mujeebu M A. Experimental investigation and optimization of heat input and coolant velocity of finned twin U-shaped heat pipe for CPU cooling[J]. Experimental Techniques,2013,37(6):34-40.

[36] 唐连伟,何雅玲,刘迎文. 双热管 CPU 散热器空气侧翅片性能的数值研究及优化设计[C]//制冷空调新技术进展—第三届制冷空调新技术研讨会,浙江,杭州,2005.

[37] Mohamed H A,Elnaggar. Numerical investigation of characteristics of wick structure and workingfluid of U-shape heat pipe for CPU cooling[J]. Microelectronics Reliability,2014,54:297-302.

[38] 周建辉,杨春信. CPU 散热器热分析与优化设计[J]. 现代电子技术,2006,18: 1-7.

[39] Zhang Chengbin,Chen Yongping,Peterson G P. Optimization of heat pipe with axial ＂Ω＂-shaped micro grooves based on a niched Pareto genetical gorithm(NPGA)[J]. AppliedThermalEngineering,2009,29:3340-3345.

[40] Lips Stéphane,Lefèvre F. A general analytical model for the design of conventional heat pipes[J]. International Journal of Heat and Mass Transfer,2014,72:288-298.

Development of heat pipe cooling technology in high heat flux electronic components

高热流密度电子元件中热管散热技术的进展

PDF (PC)

Knowledge

Abstract

Cite this article

share this article

References

Related Articles 3

Recommended Articles

Metrics

Comments

[1]	Tian ZHANG,Kaifen YAN,Chang ZHANG,Rongjian XIE,Deping DONG. Effects of pin-finned array and porous surface on two-phase confined jet-impingement cooling [J]. Chemical Industry and Engineering Progress, 2019, 38(10): 4470-4480.
[2]	ZHANG Tian, WANG Shiyue, RUI Jicai, DONG Deping, XIE Rongjian. Characteristic of an Ω-shape microchannel heatsink with different working fluid [J]. Chemical Industry and Engineering Progress, 2018, 37(08): 2954-2961.
[3]	ZENG Chuan, CHEN Jundong, LI Xue, ZHANG Shang, QIU Jie, CHEN Haiyan. Experimental research on dismantling WPCBs using hot air pulse jet [J]. Chemical Industry and Engineering Progree, 2016, 35(02): 635-641.