Investigation of a novel thermoelectric cooling device

doi:10.16085/j.issn.1000-6613.2015.03.012

Abstract

Abstract: A novel thermoelectric cooling device with a liquid cooling system was developed and assembled for sub-ambient temperature cooling of chips in over-clocking or super calculating testing system was set up and experiments were conducted to investigate the refrigeration performances of device in various application conditions. Results showed that the maximum heat dissipating capacity was 7W/cm² when case temperature was the same as ambient temperature, operating voltage of TEC was 48V and the cooling air flowrate was 3-5m/s. TEC was conducive to heat dissipation especially in high ambient temperature (35℃). The case temperature of the heat source was reduced by 5.4℃ at the input heat flux of 23.78W/cm², operating voltage of TEC 16-48V, and cooling air flowrate of 5m/s. In addition, the liquid cooling system was beneficial to coefficient of performance(COP) of TEC. The maximum COP and heat flux were 3.5 and 15W/cm² respectively at the case temperature was 10℃ higher than ambient temperature, operating voltage of TEC 4-48V and the cooling air flowrate of 3-5m/s.

Key words: thermoelectric cooling, microelectronic chips, product design, heat conduction, heat transfer

摘要： 旨在开发一种热电制冷装置(TEC), 实现微电子设备芯片低于环境温度的冷却, 解决芯片超频运行后的散热问题。为了研究该装置的制冷效果, 将其串联在传统液冷散热系统中。通过搭建实验测试平台, 对该装置在不同环境温度、芯片不同热流密度、不同工况和不同制冷效率下的制冷性能进行了实验研究。研究表明, 维持热源表面温度与环境温度相等、TEC工作电压48V、风速3~5m/s的条件下, 散热能力可达7W/cm²。散热器工作在高环境温度(35℃)下, TEC能有效降低散热阻力, 提升最大散热量。当热流密度为23.78W/cm²、风速为5m/s时, TEC工作在16~48V电压值下, 热源表面温度最大降低5.4℃。实验研究同时显示, 传统液体散热系统对提升TEC能效比(COP)有较积极的作用。维持热源表面温度比环境温度高10℃、TEC输入电压4~48V、风速3~5m/s情况下, 最大能效比达3.5, 最大热流密度达到15W/cm²。

关键词: 热电制冷, 微电子芯片, 产品设计, 热传导, 传热

CLC Number:

WANG Yaxiong, ZHANG Bo. Investigation of a novel thermoelectric cooling device[J]. Chemical Industry and Engineering Progree, 2015, 34(3): 675-679,694.

王亚雄, 张博. 新型热电制冷装置的实验开发[J]. 化工进展, 2015, 34(3): 675-679,694.

References

[1] Yousefi T, Mousavi S A, Farahbakhsh B, et al.Experimental investigation on the performance of CPU coolers:Effect of heat pipe inclination angle and the use of nanofluids[J].Microelectronics Reliability, 2013, 53(12):1954-1961.

[2] Alfieri F, Gianini S, Tiwari M K, et al.Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling[J].Numerical Heat Transfer Part A-Applications, 2014, 65(3):201-215.

[3] Brighenti F, Kamaruzaman N, Brandner J J.Investigation of self-similar heat sinks for liquid cooled electronics[J].Applied Thermal Engineering, 2013, 59(1-2):725-732.

[4] Zhang J R, Zhang T T, Prakash S, et al.Experimental and numerical study of transient electronic chip cooling by liquid flow in microchannel heat sinks[J].Numerical Heat Transfer, Part A, 2014, 65(7):627-643.

[5] Liu J J, Zhang H, Yao S C, et al.Porous media modeling of two-phase microchannel cooling of electronic chips with nonuniform power distribution[J].Journal of Electronic Packaging, 2014, 136(2):1-9.

[6] Fylladitakis E D, Moronis A X, Kiousis K.Design of a prototype EHD air pump for electronic chip cooling applications[J].Plasma Science and Technology, 2014, 16(5):491-501.

[7] Meng J H, Wang X D, Zhang X X.Transient modeling and dynamic characteristics of thermoelectric cooler[J].Applied Energy, 2013, 108:340-348.

[8] Semenyuk V.Heat sinks for miniature thermoelectric coolers:Selection and characterization[J].Journal of Electronic Materials, 2014, 43(6):2452-2458.

[9] Martinez A, Astrain D, Rodriguez A, et al.Thermoelectric self-cooling system to protect solar collectors from overheating[J].Journal of Electronic Materials, 2014, 43(6):1480-1486.

[10] Gallo A, Arana A, Oyanguren A, et al.Numerical modeling and design of thermoelectric cooling systems and its application to manufacturing machines[J].Journal of Electronic Materials, 2013, 42(7):2287-2291.

[11] Semenyuk V, Dekhtiaruk R.Novel thermoelectric modules for cooling powerful LEDs:Experimental results[J].Journal of Electronic Materials, 2013, 42(7):2227-2232.

[12] Zuo Z, Luo Q H.Experiment on performances of a thermoelectric cooler for electronic cooling[J].Applied Mechanics and Materials, 2013, 256-259:2632-2635.

[13] Redmond M, Manickaraj K, Sullivan O, et al.Hotspot cooling in stacked chips using thermoelectric coolers[J].IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3(5):759-767.

[14] Campbell L, Wright L.Analysis and testing of a thermoelectric heat exchanger configured for cooling a processor module heat load[C]//2013 Twenty Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm).San Jose, CA:IEEE, 2013:93-98.

[15] 张平, 宣益民, 李强.界面接触热阻的研究进展[J].化工学报, 2012, 63(2):335-349.

[16] Sharma S, Dwivedi V K, Pandit S N.A review of thermoelectric devices for cooling applications[J].International Journal of Green Energy, 2014, 11(9):899-909.

[17] Seifert W, Pluschke V, Hinsche N F.Thermoelectric cooler concepts and the limit for maximum cooling[J].Journal of Physics:Condensed Matter, 2014, 26(25):255803.

[18] 徐高卫, 薛建顺, 程迎军, 等.超级计算机机箱的热流场特性研究和优化设计[J].机械设计与研究, 2006, 22(6):57-61.

[19] 王亚雄, 田智凤, 韩晓星.多触点集成平板热管散热器的性能[J].化工进展, 2012, 31(8):1707-1710.

[20] Yilbas B S, Sahin A Z.Thermal characteristics of combined thermoelectric generator and refrigeration cycle[J].Energy Conversion and Management, 2014, 83:42-47.

[21] 邱泽正, 龚宇烈, 马伟斌, 等.国内外吸收压缩式热泵研究进展[J].化工进展, 2011, 30(2):264-268.