化工进展 ›› 2016, Vol. 35 ›› Issue (02): 635-641.DOI: 10.16085/j.issn.1000-6613.2016.02.046

• 资源与环境化工 • 上一篇    下一篇

热空气脉冲喷吹法拆卸废旧印刷电路板的试验

曾川1, 陈俊冬2,3, 李雪2, 张尚1, 邱洁4, 陈海焱2   

  1. 1 西南科技大学制造科学与工程学院, 四川 绵阳 621010;
    2 西南科技大学环境与资源学院, 四川 绵阳 621010;
    3 西南科技大学固废处理与资源化教育部重点实验室, 四川 绵阳 621010;
    4 西南科技大学土木工程与建筑学院, 四川 绵阳 621010
  • 收稿日期:2015-08-21 修回日期:2015-09-12 出版日期:2016-02-05 发布日期:2016-02-05
  • 通讯作者: 陈俊冬,硕士,讲师,从事机械设计制造及矿物加工工程研究。E-mail:lqxcjd@163.com。
  • 作者简介:曾川(1992-),男,硕士研究生,研究方向为固体废弃物资源化利用、超细分级设备。E-mail:1421957597@qq.com。
  • 基金资助:
    固体废物处理与资源化教育部重点实验室平台基金项目(13zxgk05)。

Experimental research on dismantling WPCBs using hot air pulse jet

ZENG Chuan1, CHEN Jundong2,3, LI Xue2, ZHANG Shang1, QIU Jie4, CHEN Haiyan2   

  1. 1 School of Manufacturing Science and Engineering, Southwest University of Science and Technology, Mianyang 621010, Sichuan, China;
    2 School of Environment and Resource, Southwest University of Science and Technology, Mianyang 621010, Sichuan, China;
    3 Key Lab of Solid Waste Treatment and Resource Recycle of Ministry of Education, Southwest University of Science and Technology, Mianyang 621010, Sichuan, China;
    4 School of Civil Engineering and Architecture, Southwest University of Science and Technology, Mianyang 621010, Sichuan, China
  • Received:2015-08-21 Revised:2015-09-12 Online:2016-02-05 Published:2016-02-05

摘要: 电子元器件的拆卸对于废旧印刷电路板(waste printed circuit boards,WPCBs)的资源化利用具有重要意义,是废旧印刷电路板回收利用必不可少的环节。文章利用热空气作为预热气源和脉冲喷吹气源,采用自主设计的WPCBs拆卸设备进行拆卸实验,运用正交试验方法研究了拆卸工艺参数对电路板拆卸率的影响,优化了工艺参数,并对影响原因进行了分析。实验结果表明:小贴片元器件拆卸率与元器件总拆卸率随喷吹次数增加先增大后减小;当进气温度为240℃、加热时间为5min、喷吹次数为10次时,插槽元器件、通孔元器件、大贴片元器件拆卸率大部分在95%以上,小贴片元器件拆卸率最高达80%以上,且元器件总拆卸率达85%以上。利用热空气作为预热气源和喷吹气源拆卸WPCBs的最优实验参数为:进气温度为240℃,加热时间为5min,喷吹次数为10次。

关键词: 废旧印刷电路板, 热空气, 脉冲喷吹, 电子元器件

Abstract: Dismantling of electronic components is of great significance in recycling waste printed circuit boards(WPCBs),as an essential part of waste printed circuit boards recycling process. In this paper,a pilot dismantling machine was described,using hot air as heat source to melt solders and as pulse-jet to separate electronic components from the base boards. Disassembly process parameters were studied using orthogonal experiment,and the optimum processing parameters were analyzed. The dismantling rate of small patch components and total dismantling rate decreased along with the increase of injection times;when the total intake air temperature was 240℃,heating time was 5 minutes,injection times was 10,the dismantling rate of slot,through-hole and big patch components was most of above 95%,the highest rate of dismantling small components was more than 80%,and the total dismantling rate was more than 85%. The optimal experimental parameters were as follows:inlet temperature 240℃,the heating time 5min,pulsed jet injection 10 times.

Key words: waste printed circuit boards(WPCBs), hot air, pulse jet, electronic components

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