Abstract: The rapid development of microelectronics brought forward an increasing demand for high thermal resistant epoxy cured products. To increase the thermal resistance of epoxy resin is imperative. Methodologies commonly used to improve the thermal resistance of epoxy resin are reviewed in this paper，including the backbone modification，the use of a novel curing agent and the hybridization with an inorganic nano-material.

摘要： 近年来，随着微电子技术的飞速发展，对应用于该领域的环氧树脂的耐热性提出了更高的要求，使得传统的环氧树脂受到严峻的挑战。因此，提高环氧树脂的耐热性势在必行。本文综述了当前国内外提高环氧树脂耐热性能所采取的方法：主要包括开发具有耐热性骨架的环氧树脂；合成具有新型结构的环氧树脂固化剂；与无机纳米材料共混或共聚。