Abstract: The history of chemical mechanical polishing (CMP) is reviewed. The polishing mechanism and application of CMP are summarized. In addition，the different polishing slurries，such as CeO2，SiO2 and Al2O3 polishing slurries，and their advantages and disadvantages，polishing mechanisms and recent preparation methods are also elaborated. Finally，the future prospect of CMP and the development trends of new types of polishing slurry are outlined.

摘要： 通过回顾化学机械抛光技术的发展历史，概述了化学机械抛光作用机制与实际应用情况，着重阐述了几种重要抛光浆料（如CeO2、SiO2、Al2O3抛光浆料）的优缺点、抛光机理及其国内外新近制备方法，进一步展望了化学机械抛光技术的发展前景与新型抛光浆料的开发方向。