Influence of methyl red on the behavior of electrodeposited copper and its application in through-hole filling
ZHANG Yang, ZHANG Yijie, ZHANG Hongzhi, QIAN Maolin, XIANG Jing
Chemical Industry and Engineering Progress . 2025, (3): 1542 -1549 .  DOI: 10.16085/j.issn.1000-6613.2024-1433

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